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 HD74ALVC1G07
Single Buffer / Driver with Open Drain
REJ03D0109-0500 Rev.5.00 Sep 08, 2006
Description
The HD74ALVC1G07 has a buffer in a 5 pin package. Low voltage and high-speed operation is suitable for the battery powered products (e.g., notebook computers), and the low power consumption extends the battery life.
Features
* The basic gate function is lined up as Renesas uni logic series. * Supplied on emboss taping for high-speed automatic mounting. * Supply voltage range : 1.2 to 3.6 V Operating temperature range : -40 to +85C * All inputs VIH (Max.) = 3.6 V (@VCC = 0 V to 3.6 V) All outputs VO (Max.) = 3.6 V (@VCC = 0 V, Output : Z) * Output current 2 mA (@VCC = 1.2V) 4 mA (@VCC = 1.4 V to 1.6 V) 6 mA (@VCC = 1.65 V to 1.95 V) 18 mA (@VCC = 2.3 V to 2.7 V) 24 mA (@VCC = 3.0 V to 3.6 V) * Ordering Information
Part Name HD74ALVC1G07VSE Package Type VSON-5 pin Package Code (Previous Code) PUSN0005KA-A (TNP-5DV) Package Abbreviation VS Taping Abbreviation (Quantity) E (3,000 pcs/reel)
Outline and Article Indication
* HD74ALVC1G07
Marking
A
E
VSON-5
= Control code
Rev.5.00 Sep 08, 2006 page 1 of 6
HD74ALVC1G06
Function Table
Input A H L H: L: Z: High level Low level High impedance Output Y Z L
Pin Arrangement
NC
1
5
VCC
IN A
2
GND
3
4
OUT Y
(Top view)
Absolute Maximum Ratings
Item Supply voltage range Input voltage range *1 Output voltage range *1, 2 Input clamp current Output clamp current Continuous output current Continuous current through VCC or GND Maximum power dissipation *3 at Ta = 25C (in still air) Storage temperature Notes: Symbol VCC VI VO IIK IOK IO ICC or IGND PT Tstg Ratings -0.5 to 4.6 -0.5 to 4.6 -0.5 to VCC+0.5 -0.5 to 4.6 -50 -50 50 100 200 -65 to 150 Unit V V V mA mA mA mA mW C Conditions
Output : L VCC : OFF or Output : Z VI < 0 VO < 0 VO = 0 to VCC
The absolute maximum ratings are values, which must not individually be exceeded, and furthermore, no two of which may be realized at the same time. 1. The input and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed. 2. This value is limited to 4.6 V maximum. 3. The maximum package power dissipation was calculated using a junction temperature of 150C.
Rev.5.00 Sep 08, 2006 page 2 of 6
HD74ALVC1G06
Recommended Operating Conditions
Item Supply voltage range Input voltage range Output voltage range Symbol VCC VI VO Min 1.2 0 0 0 0 -40 Max 3.6 3.6 3.6 2 4 6 18 24 20 10 85 Unit V V V Conditions
Output current
IOL
mA
Input transition rise or fall rate Operating free-air temperature
t / v Ta
ns / V C
VCC = 1.2 V VCC = 1.4 V VCC = 1.65 V VCC = 2.3 V VCC = 3.0 V VCC = 1.2 to 2.7 V VCC = 3.30.3 V
Note: Unused or floating inputs must be held high or low.
Electrical Characteristics
(Ta = -40 to 85C)
Item Symbol VCC (V) 1.2
*1
Min VCCx0.75 VCCx0.7 VCCx0.7 1.7 2.0
Typ
Max VCCx0.25 VCCx0.3 VCCx0.3 0.7 0.8 0.2 0.3 0.3 0.3 0.55 0.55 5 5 10
Unit
Test Conditions
VIH
1.4 to 1.6 1.65 to 1.95 2.3 to 2.7 3.0 to 3.6 1.2 1.4 to 1.6 1.65 to 1.95 2.3 to 2.7 3.0 to 3.6 Min to Max 1.2 1.4 1.65 2.3 3.0 3.6 3.6 3.6
Input voltage
V
VIL
Output voltage
VOL
V
Input current Off state output current Quiescent supply current
IIN IOZ ICC
A A A
IOL = 100 A IOL = 2 mA IOL = 4 mA IOL = 6 mA IOL = 18 mA IOL = 24 mA VIN = 3.6 V or GND VOUT = VCC or GND VIN = VCC or GND, IO = 0
Output leakage IOFF 0 5 A VIN or VOUT = 0 to 3.6 V current Input capacitance CIN 3.3 4.5 pF VIN = VCC or GND Note: For conditions shown as Min or Max, use the appropriate values under recommended operating conditions.
Rev.5.00 Sep 08, 2006 page 3 of 6
HD74ALVC1G06
Switching Characteristics
VCC = 1.2 V
Item Propagation delay time Symbol tZL tLZ Ta = -40 to 85C Min Typ Max 5.5 Unit ns Test Conditions CL = 15 pF FROM (Input) A TO (Output) Y
VCC = 1.50.1 V
Item Propagation delay time Symbol tZL tLZ Ta = -40 to 85C Min Typ Max 1.0 7.0 Unit ns Test Conditions CL = 15 pF FROM (Input) A TO (Output) Y
VCC = 1.80.15 V
Item Propagation delay time Symbol tZL tLZ Ta = -40 to 85C Min 1.0 Typ Max 5.0 Unit ns Test Conditions CL = 30 pF FROM (Input) A TO (Output) Y
VCC = 2.50.2 V
Item Propagation delay time Symbol tZL tLZ Min 0.5 Ta = -40 to 85C Typ Max 3.5 Unit ns Test Conditions CL = 30 pF FROM (Input) A TO (Output) Y
VCC = 3.30.3 V
Item Propagation delay time Symbol tZL tLZ Ta = -40 to 85C Min Typ Max 0.5 2.5 Unit ns Test Conditions CL = 30 pF FROM (Input) A TO (Output) Y
Operating Characteristics
(Ta = 25C)
Item Power dissipation capacitance Symbol VCC (V) 1.5 1.8 2.5 3.3 Min Typ 2.0 2.0 2.5 3.5 Max Unit Test Conditions
CPD
pF
f = 10 MHz
Rev.5.00 Sep 08, 2006 page 4 of 6
HD74ALVC1G06
Test Circuit
*1
VCC
VCC x 2 or 6.0 V
RL Pulse Generator Z out = 50 CL RL Input Output
Symbol RL CL
*1
VCC = 1.2 V, V = 1.80.15 V VCC = 2.50.2 V VCC = 3.30.3 V 1.50.1 V CC 2.0 k 15 pF VCC x 2 1.0 k 30 pF VCC x 2 500 30 pF VCC x 2 500 30 pF 6.0 V
Note: CL includes probe and jig capacitance.
Waveforms
tf tr
90% Input V ref 10% t ZL 10%
90% V ref
VIH
GND t LZ
VOH Output V ref VL VOL
Symbol tr / t f V IH V ref VL
VCC = 1.2 V, 1.50.1 V 2.0 ns VCC 50% VL = VOL+0.1 V
VCC = 1.80.15 V VCC = 2.50.2 V 2.0 ns VCC 50% 2.5 ns VCC 50%
VCC = 3.30.3 V 2.5 ns 2.7 V 1.5 V
VL = VOL+0.15 V VL = VOL+0.15 V VL = VOL+0.3 V
Note: Input waveform : PRR = 10 MHz, duty cycle 50%
Rev.5.00 Sep 08, 2006 page 5 of 6
HD74ALVC1G06
Package Dimensions
JEITA Package Code P-USON5-1.2x1.6-0.50 RENESAS Code PUSN0005KA-A Previous Code TNP-5D/TNP-5DV MASS[Typ.] 0.002g
D 1.0 0.1 5 4
L1
HE
E
1
3 c
Reference Dimension in Millimeters Symbol
( 0.1 )
( 0.1 )
e
b
D E A A1 A2 b b1 e Lp x y ZD c c1 HE L1
Min Nom Max 1.55 1.6 1.65 1.1 1.2 1.3 0.6
A
0.15
0.2 0.5
0.3
0.07 0.12 0.22 1.55 1.6 0.2 1.65
Rev.5.00 Sep 08, 2006 page 6 of 6
Sales Strategic Planning Div.
Keep safety first in your circuit designs!
Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan
1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage. Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or mishap. Notes regarding these materials 1. These materials are intended as a reference to assist our customers in the selection of the Renesas Technology Corp. product best suited to the customer's application; they do not convey any license under any intellectual property rights, or any other rights, belonging to Renesas Technology Corp. or a third party. 2. Renesas Technology Corp. assumes no responsibility for any damage, or infringement of any third-party's rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or circuit application examples contained in these materials. 3. All information contained in these materials, including product data, diagrams, charts, programs and algorithms represents information on products at the time of publication of these materials, and are subject to change by Renesas Technology Corp. without notice due to product improvements or other reasons. It is therefore recommended that customers contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor for the latest product information before purchasing a product listed herein. The information described here may contain technical inaccuracies or typographical errors. Renesas Technology Corp. assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies or errors. Please also pay attention to information published by Renesas Technology Corp. by various means, including the Renesas Technology Corp. Semiconductor home page (http://www.renesas.com). 4. When using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and algorithms, please be sure to evaluate all information as a total system before making a final decision on the applicability of the information and products. Renesas Technology Corp. assumes no responsibility for any damage, liability or other loss resulting from the information contained herein. 5. Renesas Technology Corp. semiconductors are not designed or manufactured for use in a device or system that is used under circumstances in which human life is potentially at stake. Please contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor when considering the use of a product contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater use. 6. The prior written approval of Renesas Technology Corp. is necessary to reprint or reproduce in whole or in part these materials. 7. If these products or technologies are subject to the Japanese export control restrictions, they must be exported under a license from the Japanese government and cannot be imported into a country other than the approved destination. Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the country of destination is prohibited. 8. Please contact Renesas Technology Corp. for further details on these materials or the products contained therein.
RENESAS SALES OFFICES
Refer to "http://www.renesas.com/en/network" for the latest and detailed information. Renesas Technology America, Inc. 450 Holger Way, San Jose, CA 95134-1368, U.S.A Tel: <1> (408) 382-7500, Fax: <1> (408) 382-7501 Renesas Technology Europe Limited Dukes Meadow, Millboard Road, Bourne End, Buckinghamshire, SL8 5FH, U.K. Tel: <44> (1628) 585-100, Fax: <44> (1628) 585-900 Renesas Technology (Shanghai) Co., Ltd. Unit 204, 205, AZIACenter, No.1233 Lujiazui Ring Rd, Pudong District, Shanghai, China 200120 Tel: <86> (21) 5877-1818, Fax: <86> (21) 6887-7898 Renesas Technology Hong Kong Ltd. 7th Floor, North Tower, World Finance Centre, Harbour City, 1 Canton Road, Tsimshatsui, Kowloon, Hong Kong Tel: <852> 2265-6688, Fax: <852> 2730-6071 Renesas Technology Taiwan Co., Ltd. 10th Floor, No.99, Fushing North Road, Taipei, Taiwan Tel: <886> (2) 2715-2888, Fax: <886> (2) 2713-2999 Renesas Technology Singapore Pte. Ltd. 1 Harbour Front Avenue, #06-10, Keppel Bay Tower, Singapore 098632 Tel: <65> 6213-0200, Fax: <65> 6278-8001 Renesas Technology Korea Co., Ltd. Kukje Center Bldg. 18th Fl., 191, 2-ka, Hangang-ro, Yongsan-ku, Seoul 140-702, Korea Tel: <82> (2) 796-3115, Fax: <82> (2) 796-2145
http://www.renesas.com
Renesas Technology Malaysia Sdn. Bhd Unit 906, Block B, Menara Amcorp, Amcorp Trade Centre, No.18, Jalan Persiaran Barat, 46050 Petaling Jaya, Selangor Darul Ehsan, Malaysia Tel: <603> 7955-9390, Fax: <603> 7955-9510
(c) 2006. Renesas Technology Corp., All rights reserved. Printed in Japan.
Colophon .6.0


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